industry news
Subscribe Now

Saelig Debuts Mix-and-Match RF Design System

RF made easy! BeeWave readymade ‘plug and play’ modules are available for most typical RF functions up to 6GHz, connected via cables on the powered baseboard to rapidly build complete RF circuits. BeeWave is ideal for hands-on education of RF and microwave concepts, and it is the fastest way to prototype, test, and validate RF circuit designs.
Fairport, NY: Saelig Company, Inc. has introduced BeeWave – a novel wireless front-end concept that allows users to build complete, functioning complex RF circuits on a desktop without requiring any tools. BeeWave acts like an RF breadboard for placing and connecting different ready-made modules, each performing an RF function, to create a wireless system. This novel approach for RF and microwave design enables demonstrations, teaching, and implementation through these simple ‘plug and play’ modules.
Readymade ‘plug and play’ modules are available for most typical RF functions up to 6GHz. Just connect modules on the powered baseboard to build complete RF circuits rapidly. BeeWave is ideal for hands-on education of RF and microwave concepts, and it is the fastest way to prototype, test, and validate RF circuit designs. BeeWave allows users to build any RF and microwave circuits without the need for complex RF PCB design and fabrication. BeeWave allows for multiple design iterations without the cost or delay of PCB re-fabrication
Readymade configurations are available for education and classroom training. These PC-controlled modules are compatible with Matlab and other programming systems. This experiment aims at exploring the functionality and structure of RF down-converters. Students will begin to rapidly understand the underlying RF technology and they will learn how to implement, setup, and operate, for instance, a single-stage down-converter using SpectraTronix BeeWave System through hands-on interaction with the system to comprehend the effects of different building blocks and their functions.
Available BeeWave Modules include:
  • Wideband Amplifiers up to 6GHz (fixed & variable gain; PC controlled)
  • LNA Wideband up to 2,700MHz
  • Mixers, wideband up to 14GHz (PC Controlled)
  • RF Switches 2-Port & 4-Port up to 6 GHz (PC Controlled)
  • Low pass filters up to 6 GHz
  • Band pass filters up to 6 GHz (Narrow/Wideband)
  • Variable Attenuators up to 6 GHz (PC controlled)
  • Clock Reference 10 MHz, up to 4 output ports
  • PLL/LO Wideband up to 6 GHz (PC controlled)
This software-tunable generator is suitable for use in applications such as wireless communications systems, RF and microwave radios, software defined radio, radar, automated test equipment (ATE), radiated immunity pre-compliance testing, electronic warfare, law enforcement, medical research, etc.
Superior RF performance makes BeeWave an ideal tool for professional prototyping, while ease of use, pre-built teaching configurations, and PC/Matlab connectivity make this a perfect hands-on tool for teaching RF and wireless concepts. No need to worry about constructing, biasing, powering, or matching complex components on a PCB. Made by RF designers SpectraTronix, BeeWave is available now from Saelig Company, Inc. Fairport NY their USA technical distributor. For detailed specifications, free technical assistance, or additional information, please contact Saelig at 1-888-7SAELIG, via email: info@saelig.com, or visit www.saelig.com.
About Saelig Company Inc.
Founded in 1988 in Rochester, New York, Saelig is a North American distributor with a growing reputation for finding and sourcing remarkable, unique test and measurement and control products and components for use in a wide variety of industries. Products lines are continuously added from sources across the globe, and are offered at competitive prices, accompanied by full in-house technical support, exceptional customer service, and fast delivery. For full details of available product lines, please visit www.saelig.com.

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Package Evolution for MOSFETs and Diodes
Sponsored by Mouser Electronics and Vishay
A limiting factor for both MOSFETs and diodes is power dissipation per unit area and your choice of packaging can make a big difference in power dissipation. In this episode of Chalk Talk, Amelia Dalton and Brian Zachrel from Vishay investigate how package evolution has led to new advancements in diodes and MOSFETs including minimizing package resistance, increasing power density, and more! They also explore the benefits of using Vishay’s small and efficient PowerPAK® and eSMP® packages and the migration path you will need to keep in mind when using these solutions in your next design.
Jul 10, 2023
32,434 views