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The agreement, which is effective immediately, builds on the existing relationship between the companies and guarantees wafer supply for GF’s 22nm FD-SOI (22FDX) technology platform.
“Globalfoundriesis delivering industry leading ultra-low power, performance-on-demand FD-SOI solutions with cost-sensitive manufacturing options,” says GloFo’s John Docherty, “with Soitec as a long-term strategic partner, this agreement ensures a secure supply to meet the high-volume capacity needs of current and future customers.”
.” This strategic agreement, with very significant wafer volumes, reflects GF’s strong confidence in Soitec as we build the required capacity to serve the growing FD-SOI demand, ” says Soitec’s Christopher Malevilke.
FD-SOI semiconductor technology has been made possible by the mutual commitment of many companies to deliver breakthroughs at both the device and substrate levels.
GF and Soitec collaborate very closely to ensure landmark FD-SOI performance advantages at the right cost in developing the foundry’s FDX platforms.
The FD-SOI process technologies are based on ultra-thin SOI substrates manufactured with Soitec’s industry-standard Smart Cut(TM) technology to generate ultra-thin layers with high quality and uniformity.
Offering the best power, performance, area and cost (PPAC) optimization of advanced planar technologies in smart phones, automotive electronics, and Internet of Things (IoT) applications, FD-SOI is quickly becoming a new mainstream process technology for battery powered, wireless and connected devices.
