Toshiba introduces wide leadform package for SO6L optocouplers

Toshiba is in mass production of optocouplers in a new wide leadform package type SO6L(LF4).

The wide leadform option is available for three high-speed IC photocouplers and five IGBT/MOSFET driver photocouplers.

The new photocouplers can be directly mounted on PCB pads intended for SDIP6(F type) products.

The SO6L(LF4)’s 2.3mm (max.) low profile package offers a 45% height reduction over SDIP6(F Type) and allows use in height-critical applications, such as mounting on the underside of PCBs.

The SO6L(LF4) package has a pin spacing of 9.35mm (min.) giving a safety creepage distance of 8.0mm and a BVs of 5kVrms (min.).

To support the replacement of more popular SDIP6(F type) package products, Toshiba will expand the wide leadform option to include other SO6L IC photocouplers.

The new devices are suitable forb high-speed digital interfacing, I/O interfaces, PLCs, intelligent power modules and inverters for air conditioning, industrial applications and solar energy.