Infineon launches 50mm solder bond thyristor/diode modules

Infineon has volume availability of thyristor/diode modules in solder bond technology with a 50 mm module and plans to launch additional module types with blocking voltages of 1800 V and 2200 V in 2017.

Solder bond modules are for applications where the high robustness of pressure contact technology is not necessarily a must. Typical applications for the 50 mm modules are drives, power supplies and welding.

The 50 mm variant covers current ratings from 280 A to 330 A.

All modules are offered in the topologies thyristor/thyristor, thyristor/diode and diode/diode with a blocking voltage of 1600 V and in current ratings from 55 A to 330 A.